Modular devices and systems configured to receive a plurality of removable modules and to enable data transfer between the modules

ABSTRACT

An electronic device includes a backplane including a set of slots configured to receive user-removable modules; a printed circuit board, coupled to the backplane; and a set of interface blocks, electrically connected to the printed circuit board, that enable power and data transfer between modules coupled to the set of interface blocks.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/896,564, filed on 28 Oct. 2013, which is incorporated in its entiretyby this reference.

TECHNICAL FIELD

This invention relates generally to the mobile electronics field, andmore specifically to new and useful modular devices and systems in themobile electronics field.

BACKGROUND

There are many types of mobile telephones today. Some phones areconfigured to provide basic telephone features, and may be referred toas feature phones. Other phones may be configured to provide morefunctionality, and may be referred to as smartphones. Smartphones may beconfigured to operate according to a mobile operating system, andgenerally provide more advanced computing capability and connectivitythan feature phones. Many smartphones combine functions of a personaldigital assistant (PDA) with a mobile phone. Some smart phones addfunctionality of portable media players, compact digital cameras, pocketvideo cameras, GPS navigation units, etc., to form one multi-use device.Typical phones (either smartphones or feature phones) include multipleinternal hardware components enclosed within a housing, a battery, and adisplay.

SUMMARY

Within examples, a computing device is provided that includes abackplane or other receptacle configured to receive a number ofremovable modules that may be positioned into slots in the backplane.The removable modules may include various components and/or electronics.In one example, the removable modules may be configured to performfunctions of a mobile telephone (either independently or throughcoordination). In other examples, the removable modules may beconfigured to perform any type or number of functions, and suchfunctions may be independently performed by distinct modules orperformed by a combination of modules. Still further, in some examples,the modules and respective covers provide a canvas for aestheticcustomization of the computing device.

Within examples, the backplane is configured to enable power transferand communications between the modules, and to mechanically couplemodules together to form an integral device or housing for the modules.

Many of the described components and functions of examples herein may bedivided up into additional functional or physical components, orcombined into fewer functional or physical components. In some furtherexamples, additional functional and/or physical components may be addedto the examples as well.

These as well as other aspects, advantages, and alternatives, willbecome apparent to those of ordinary skill in the art by reading thefollowing detailed description, with reference where appropriate to theaccompanying figures.

BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1A-1C illustrate example configurations for a computing device;

FIGS. 2A-2C illustrate example arrangements of rails in a computingdevice;

FIGS. 3A-3C illustrate a front view of example configurations of adevice;

FIGS. 4A-4C illustrate example side, front, and back views of exampleconfigurations of a device;

FIG. 5 illustrates a portion of a device, which may be any of thedevices shown in FIGS. 1-4;

FIG. 6 illustrates a side view of a portion of a device, which may beany of the devices shown in FIGS. 1-4;

FIG. 7 illustrates a top and side view of a module;

FIGS. 8A-8B illustrate a front side of a device;

FIG. 9A illustrates a back side of a device;

FIG. 9B illustrates a bottom view of example modules;

FIGS. 10A-10C illustrate front and back views of example configurationsof a backplane of a device with no modules installed;

FIG. 11 illustrates an example 1×1 module;

FIG. 12A illustrates an example configuration of a removable module in arectangular format;

FIG. 12B illustrates another example configuration of a removable modulein a rectangular format;

FIG. 13A illustrates an example configuration of a removable module in alarger square format;

FIG. 13B illustrates another example configuration of a removable modulein a square format;

FIGS. 14A-14B illustrate example placement of modules into backplanes ofmultiple configurations;

FIG. 15 illustrates a side view of an example device in which moduleshave been inserted;

FIG. 16 illustrates a portion of an example device in which a moduleexceeds a thickness dimension of the device;

FIGS. 17A-17B illustrate an example device in which a module exceeds alength dimension of the device;

FIG. 18 illustrates an expanded view of an example device;

FIG. 19 illustrates an expanded view of an example module;

FIGS. 20-21 illustrate portions of a module with an electro-permanentmagnet;

FIG. 22 illustrates a portion of a device in which a module is securedto the device via an electro-permanent magnet;

FIG. 23 illustrates portions of a device in which a module is secured tothe device;

FIG. 24 illustrates an example printed circuit board of a device; and

FIG. 25 illustrates an example printed circuit board schematic includinga switch.

DETAILED DESCRIPTION

The following detailed description describes various features andfunctions of the disclosed systems and methods with reference to theaccompanying figures. In the figures, similar symbols identify similarcomponents, unless context dictates otherwise. The illustrative systemand method embodiments described herein are not meant to be limiting. Itmay be readily understood that certain aspects of the disclosed systemsand methods can be arranged and combined in a wide variety of differentconfigurations, all of which are contemplated herein.

Within examples, a computing device is provided that includes abackplane configured to receive user-removable modules that may bepositioned into slots in the backplane. In one example, the device maybe a mobile telephone, and the modules may contain various mobile phonecomponents. The backplane allows for power transfer and communicationsbetween the modules, and may hold the module together into an integraldevice without the need for an enclosure or a housing physicallysurrounding the modules, for example. The backplane may include acommunication network switch (e.g., Unipro switch, PCIe switch) thatdirects incoming data packets from modules to an appropriate output port(e.g., to another module, or to backplane components), power switches onbackplane power ports to enable reset or shutdown of modules, andcurrent-monitoring or current-limiting circuitry on each power port tolimit inflows and outflows of power. The backplane may optionallyinclude a button to engage or disengage locking mechanisms of themodules to enable removable or locking of the modules, and the backplanemay also optionally include an indicator LED or other display to providestatus information.

Referring now to the figures, FIGS. 1A-1C illustrate exampleconfigurations for a computing device. The computing device may take theform of a mobile telephone, a tablet computer, a digital music player,or any other general purpose computing device. The configurations asshown in FIGS. 1A-1C are of three different size computing devices. Aconfiguration of the devices is based on a grid system 100, each deviceoccupying a portion of space of the grid 100. For example, the largeconfiguration shown in FIG. 1A comprises a 4×7 portion of the grid 100,the medium configuration shown in FIG. 1B comprises a 3×6 portion of thegrid 100, and the small configuration shown in FIG. 1C comprises a 2×5portion of the grid 100.

The grid 100 may be any number of cells, and in the example shown inFIG. 1A, a maximum grid size may be 4×7. Each cell of the grid 100 maybe multiple sizes, and one example includes 20 mm×20 mm. Each cell ofthe grid 100 is preferably a uniform size, but alternatively, a singlegrid may contain multiple grid cell sizes.

While examples of the grid are shown as rectangular grids, the grid 100may be any subdivision of a maximum computing device size (e.g., atriangular grid).

Each device shown in FIGS. 1A-1C is configured to hold or otherwisecouple a number of modules. A number, size, and orientation of modulesfor each device are based on an arrangement of rails in on a backplaneof the devices. Thus, a parceling of the devices into same size cells ofthe grid 100 may enable modules to be used in all sizes of the devices,such that some modules may be used in multiple configurations of thedevice. Example module sizes include a 1×1 (e.g., 20×20 mm), a 1×2(e.g., 20×43 mm), and a 2×2 (e.g., 43×43 mm). In some examples, however,some module sizes may only be used within some device configurations dueto size of the modules or a configuration of the device.

FIGS. 2A-2C illustrate example arrangements of rails in a computingdevice 200. The computing device 200 may include a backplane 202 ontowhich rails are formed. For example, in FIG. 2A, the device 200 is shownwith multiple rails, one of which is a spine 204 that extends along alength of the device 200. Other rails include ribs 206, 208 and 210 thatare positioned perpendicular to the spine 204. Some rails, such as theribs 206 and 208, extend from the spine 204 to a perimeter of the device200, while other rails, such as rail 210, may extend across a width ofthe device 200. Within examples, the rails provide structural strengthfor the device 200 along a length and width of the device 200.

FIGS. 2B and 2C illustrate additional example configurations of rails inwhich more ribs may be provided, and more ribs may extend across a widthof the device 200. The rails may form slots into which modules, such asmodule 212, may be inserted. A number and configuration of the rails onthe backplane 202 may dictate a number of slots, and thus, number ofmodules that the device 200 can accommodate. For example, the device 200in FIG. 2A is configured to accommodate up to eight modules, a device asshown in FIG. 2B is configured to accommodate up to nine modules, and adevice as shown in FIG. 2C is configured to accommodate up to twelvemodules. In some examples, slots that are formed by the rails may alsosecure the modules in the Z dimension.

FIGS. 1A-1C and FIGS. 2A-2C illustrate a back view of the device inmultiple example configurations.

FIGS. 3A-3C illustrate a front view of example configurations of adevice 300. In FIG. 3A, the device 300 is shown to include a backplane302 onto which rails 304 and 306 are formed. Each of rails 304 and 306extend across a width of the device 300 and segment a front of thedevice 300 into separate areas for separate modules. For example, a topand bottom portion of the device 300 includes modules 308 and 310, and acenter section includes module 312 which may be a display module. In theexamples shown in FIGS. 3A-3C, the front of the backplane 302 does notinclude a spine or any rail that extends along a length of the device300 to enable the center section to include an uninterrupted area forthe display module 312, for example. In other examples, however, thefront of the backplane 302 may include a spine (not shown), or mayotherwise be configured similarly to a back of the backplane as shown inany of FIGS. 1A-1C and FIGS. 2A-2C.

FIG. 3B illustrates a front view of another example configuration of adevice. In FIG. 3B, there is one rail at a top area of the device tosegment the device into two portions. FIG. 3C illustrates a front viewof yet another example configuration of a device. In FIG. 3C, there areno rails on the front of the backplane, and thus, an entirety of thefront of the device may include a display module, for example.

FIGS. 4A-4C illustrate example side, front, and back views of exampleconfigurations of a device. FIG. 4A illustrates a large configuration ofa device, which may have overall dimensions of 164 mm×91 mm×9 mm, forexample. The large configuration may be configured to accommodate up toten customizable modules, and may have a single front-facing displaymodule slot, and nine rear-facing module slots. In some configurations,the large device may be configured to accommodate fourteen 1×2 modules,and a front side may support four modules rather than a single display.

FIG. 4B illustrates a medium configuration of a device, which may haveoverall dimensions of 141 mm×68 mm×9 mm, for example. The mediumconfiguration may be configured to accommodate up to ten customizablemodules, and may have two (or three) front-facing module slots for adisplay module and other modules (e.g., a media/E-Ink module), and sixrear-facing module slots. In other examples, the medium device may beconfigured to support twelve modules (e.g., six 1×2 modules and six 1×1modules), and four front side modules. In FIG. 4B, some example modulesare shown on a front side of the device including a speaker module 402that may include a camera 404, a display module 406 that may includevolume buttons 408 and a microphone 410 on a side portion of the displaymodule 406 as well as a power button 412 on another side of the displaymodule 406. Additional example modules are shown on a backside of thedevice including a module 414 (e.g., configured to have any functionside as additional cameras, LED lighting, etc.), a battery module 416, aswitch 418, a micro USB 420, a radio 422 (e.g., including antenna), anapplication processor (AP)424, and another battery 426. Such modules areexamples only, and many other types of modules or modules configured toprovide or perform alternate or additional functionality may beincluded.

FIG. 4C illustrates a small configuration of a device, which may haveoverall dimensions of 118 mm×45 mm×9 mm, for example. The smallconfiguration may be configured to accommodate up to eight customizablemodules, and may have two front-facing module slots for a display module430 (which may include a speaker and camera 432) and a media/E-Inkmodule 434, and six rear-facing module slots. The display module 430 mayinclude volume buttons 436 and a microphone 438 on a side of the displaymodule 430, and a power button 440 on another side of the display module430. In FIG. 4C, some example modules are shown on a back side of thedevice including a switch 442, an application processor (AP)444, a radio446, a camera module 448, a battery module 450, and a USB and powermodule 452. In other examples, the small device may include ten backsidemodules (e.g., 1×1 modules) and four front side modules.

The slots within the example configurations shown in FIGS. 4A-4C may beof same shapes and sizes to allow for universal use of modules acrossmultiple configurations. For example, the medium and largeconfigurations may accept all types of modules, while the smallconfiguration may accept 1×1 and 1×2 modules. However, in some exampleconfigurations, the large device may not accept 1×1 modules.

FIG. 5 illustrates a portion of a device, which may be any of thedevices shown in FIGS. 1-4. The portion in FIG. 5 illustrates rails of abackplane including rails 502 and 504. Each of the rails 502 and 504 maybe 2.5 mm in width, for example.

FIG. 6 illustrates a side view of a portion of a device, which may beany of the devices shown in FIGS. 1-4. In FIG. 6, a backplane 602 isillustrated, and a backside of the back plane includes modules 604 and606, and a front side of the back plane includes a module 608. Athickness of each of the modules may be 4 mm, and a thickness or spacingbetween the modules may be 1.5 mm, for a total thickness of the deviceof about 9.5 mm, for example. In FIG. 6, a magnified view of a portionof the device is shown to illustrate a distance 610 between the modulesof 1 mm and to illustrate that the backplane 602 sits a distance 612 ofabout 0.5 mm below a surface of the modules, for example.

FIG. 7 illustrates a top and side view of a module. As shown in FIG. 7,the module has a curved corner of about 1.5 mm radius and is acontinuous section all around. In some examples, curvature of themodules enables the rails to provide structural constraints to hold themodules into the frame from a normal direction. The curvature may bemore pronounced at a top than a bottom of the module. The continuoussection all around the modules allows for the 1×2 module to be rotatedfrom a horizontal to a vertical orientation and still be held by asection profile of the module in the normal direction.

FIGS. 8A-8B illustrate a front side of a device. The front side includestwo slots 802 and 804 divided by a rail 806. A display module 808 mayslide into the slot 804, and another module (e.g., an e-ink display) mayslide into the slot 802. FIG. 8B illustrates the device with the modulesfully inserted into the slots.

FIG. 9A illustrates a back side of a device. The back side includesmultiple slots defined by rails, such as a spine 902 and a rib 904.Example slots include slots 906 and 908. In FIG. 9A, the back side isshown to include multiple modules as well, such as module 910, whichslides into the slot 908. The slots include interface blocks, such asinterface block 912, which couples with an interface block on anunderside of the module 910. The interface block includes a powercontact (e.g., power pins) configured to provide power to the module 910and data interfaces (e.g., a capacitive pad) configured to enable datatransfer between modules. The power contact may be configured to providepower to the module 910, or to receive power from the module 910 (e.g.,a module may be configured to generate power, such as through use ofinductive charging coils, photovoltaics, hand-crank generators, and fuelcells). The data interface may be configured to transfer data usingcapacitive pads, or through use of current conduction as well. Infurther examples, the data interface may be configured to transfer datausing an optical interface (e.g., laser diode/photodiode pair), ahigh-frequency (e.g., 60 GHz) RF, or near-field magnetic communicationsas well.

The slots further include a metal insert, such as metal insert 914 (ormetal portion), which is configured to secure the module 910 within theslot 908 via a received magnetic force. The metal insert 914 may be offerromagnetic material. For example, the spine 902 may form a portion ofeach slot, and the metal insert 914 for each slot may be included in aportion of the spine 902 forms at positions on the spine 902corresponding to the portion of the slots. The metal insert 914 may beflush with the spine 902. In some examples, the backplane or spine 902may comprise a metal, such as steel or another soft magnetic material,and the metal insert 914 may be unnecessary since the spine 902comprises a magnetic material. Thus, the metal insert 914 may bereplaced by a metal portion within the spine 902, or the spine 902itself may comprise a metal portion within the slot 908, for example.

The spine 902 and the rib 904, as well as other rails of the device, mayinclude grooves 903 configured to enable modules to slide intorespective slots due to a rounded configuration of the modules (e.g., asshown in the side view in FIG. 7). In other examples, the slots mayinclude indents that are configured to secure the modules within theslots by receiving a corresponding protrusion of the modules.

FIG. 9B illustrates a bottom view of example modules. A first examplemodule 950 may be a 1×1 module (e.g., configured to fit into a slothaving a size of 1×1 in the grid as shown in FIGS. 1A-1C, for example).A second example module 952 may be a 1×2 module (e.g., configured to fitinto a slot having a size of 1×2 in the grid as shown in FIGS. 1A-1C,for example). A third example module 954 may be a 2×2 module (e.g.,configured to fit into a slot having a size of 2×2 in the grid as shownin FIGS. 1A-1C, for example). Each of the modules 950, 952, and 954includes an interface block, such as interface block 956 on the module950, for example. In addition, each of the modules 950, 952, and 954includes an electro-permanent magnet, such as electro-permanent magnet958 on the module 954. The modules are configured to slide into slots onthe device such that interface blocks of the modules couple to interfaceblocks in the slots, and such that the electro-permanent magnet of themodules secures to the metal inserts in the slots, for example, asdescribed more fully below. Modules may further include pins (for power)and data transfer pads (e.g., capacitive pads, inductive coils, oroptical transceivers) for data transfer, or may include data pins forpower and data transfer.

FIGS. 10A-10C illustrate front and back views of example configurationsof a backplane of a device with no modules installed. In the front viewof FIG. 10A, a small configuration of a backplane is shown that includesthree cross rails 1002, 1004, and 1006 that form two slots 1008 and1010. Each slot includes an interface block, such as interface block1012, arranged in a horizontal manner. The interface block 1012 includespower contacts at a bottom of the interface block 1012 and labeled aspositive and negative polarity. In the front view example configuration,a positive polarity is on a right and a negative polarity is on a left.The interface block 1012 also includes other capacitive pads to enabledata transfer.

In the back view of FIG. 10A, the backplane includes a spine 1020, and anumber or cross rails 1022, 1024, 1026, 1028, 1030, and 1032, whichtogether form a number of slots 1034, 1036, 1038, 1040, 1042, and 1044.As shown some slots (e.g., slots 1038 and 1044) are square slots or 1×1slots, and other slots (e.g., slots 1034, 1036, 1040, and 1042) arerectangular slots or 1×2 slots. Each of the slots includes an interfaceblock, such as interface block 1046, arranged in a vertical manner. Forinterface blocks on a left side of the device, power contacts arepositioned such that negative polarity is on top and positive polarityis on bottom. For interface block 1046 arranged vertically on a rightside of the device, power contacts are positioned such that a positivepolarity is on top and a negative polarity is on bottom. In the backview of FIG. 10A, the interface blocks are shown to be mirrored inplacement from left to right (with polarity reversed) to enable a 1×2module to be used in the small configuration device, and also to be usedin the medium or large configuration device by rotating the 1×2 moduleand lining up pads on a bottom of the 1×2 module with those on thedevice appropriately. In addition, a 1×1 module may be used on either aleft or right side of the device by rotating the 1×1 module 180 degreesto have polarity lined up appropriately.

In the front view of FIG. 10B, a medium configuration of a backplane isshown that includes three cross rails 1050, 1051, and 1052 that form twoslots 1053 and 1054. Each slot includes an interface block, such asinterface block 1055, arranged in a horizontal manner. The interfaceblock 1056 includes power contacts at a bottom of the interface block1056 and labeled as positive and negative polarity. In the front viewexample configuration, a positive polarity is on a right and a negativepolarity is on a left. The interface block 1055 also includes othercapacitive pads to enable data transfer. Other interface blocks, such asinterface block 1056, may be provided as well, in which power contactsare positioned at a top of the interface block 1056, for example.

In the back view of FIG. 10B, the backplane includes a spine 1057, and anumber or cross rails 1058, 1059, 1060, 1061, 1062, 1063, 1064, 1065,which together form a number of slots 1066, 1067, 1068, 1069, 1070,1071, 1072, and 1073. As shown some slots (e.g., slots 1070 and 1071)are square slots or 1×1 slots, some slots (e.g., slots 1066, 1069, 1072,and 1073) are rectangular slots or 1×2 slots, and other slots (e.g.,slots 1067 and 1068) are square slots or 2×2 slots. Each of the slotsincludes an interface block, such as interface block 1074. Slots on aright side of the backplane include interface blocks arranged in ahorizontal manner such that polarity of the power pins has a positivepolarity to the left and a negative polarity to the right. Slots on aleft side of the backplane include interface blocks arranged in avertical manner such that polarity of the power pins has a positivepolarity on bottom and a negative polarity on top. Some slots mayinclude multiple interface blocks, such as slot 1068, for example.

In addition, in the back view of FIG. 10B, some slots are shown toinclude multiple interface blocks within a given slot. For example,larger slots such as slots 1067 and 1068 include two interface blocksthat may couple with multiple interface blocks of larger modules toenable additional data transfer. However, not all interface blockswithin a given slot, or all capacitive data pads of the interfaceblocks, may be used at all times.

In the front view of FIG. 10C, a large configuration of a backplane isshown that includes two cross rails 1075 and 1076 that form a slot thatincludes multiple interface blocks, such as interface block 1077,arranged in a horizontal manner. The interface block 107 includes powercontacts at a bottom of the interface block 107 and labeled as positiveand negative polarity. In the front view example configuration, apositive polarity is on a right and a negative polarity is on a left.The interface block 1077 also includes other capacitive pads to enabledata transfer. Other interface blocks may be provided as well in whichpower contacts are positioned at a top of the interface block, forexample.

In the back view of FIG. 10B, the backplane includes a spine 1078, and anumber or cross rails 1079, 1080, 1081, 1082, 1083, 1084, 1085, 1086,which together form a number of slots 1087, 1088, 1089, 1090, 1091,1092, 1093, 1094, and 1095. As shown some slots (e.g., slots 1087, 1090,1091, and 1093) are rectangular slots or 1×2 slots, and other slots(e.g., slots 1088, 1089, 1092, 1094, and 1095) are square slots or 2×2slots. Each of the slots includes an interface block. Slots on a rightside of the backplane include interface blocks arranged in a horizontalmanner such that polarity of the power pins has a positive polarity tothe left and a negative polarity to the right. Slots on a left side ofthe backplane include interface blocks arranged such that polarity ofthe power pins has an opposite configuration.

FIGS. 11-13 illustrate example configurations of removable modules. FIG.11 illustrates a 1×1 module 1100, for example, which includes aninterface block 1102 arranged in a vertical manner. The interface block1102 includes power pins labeled with positive and negative polarity.The interface block 1102 further includes eight capacitive padsconfigured for data transfer. In FIG. 11, the median interface block1102 is described as being arranged vertically on the module 1100,however, such an arrangement may be dependent upon how the module 1100is positioned. The interface block 1102 is arranged along a length ofthe module 1100, and since the module 1100 is square, the interfaceblock 1102 may be considered arranged vertically or horizontallydepending upon a position of the module 1100.

FIG. 12A illustrates an example configuration of a removable module 1200in a rectangular format. The module 1200 includes an interface block1202 arranged in a vertical manner. FIG. 12B illustrates another exampleconfiguration of a removable module 1210 in a rectangular format. Themodule 1210 includes two interface blocks 1212 and 1214 arrangedvertically. For the rectangular module shown in FIGS. 12A-12B, oneinterface block is required. The arrangement shown in FIG. 12Billustrates an optional configuration in which two pads may be providedfor additional functionality depending upon details of the electronicsof the module 1210, for example. In FIGS. 12A-12B, interface blocks aredescribed as being arranged vertically on the modules, however, such anarrangement may be dependent upon how the module is positioned. Themodules 1200 and 1210 are rectangular, and the interface blocks arepositioned along a length of the rectangle or along a long-edge side ofthe rectangle, for example.

In some examples, due to a configuration and arrangement of theinterface block 1202, the module 1200 may be positioned vertically orhorizontally into a backplane.

FIG. 13A illustrates an example configuration of a removable module 1300in a larger square format. The module 1300 includes an interface block1302 arranged in a horizontal manner. FIG. 13B illustrates anotherexample configuration of a removable module 1310 in a square format. Themodule 1310 includes two interface blocks 1312 and 1314 arrangedhorizontally. For the rectangular module shown in FIGS. 13A-B, oneinterface block is required. The arrangement shown in FIG. 13Billustrates an optional configuration in which two pads may be providedfor additional functionality depending upon details of the electronicsof the module 1310, for example. In FIGS. 13A-B, the interface blocksare described as being arranged horizontally on the modules, however,such an arrangement may be dependent upon how the module is positioned.The interface blocks are arranged along a length of the modules, andsince the modules are square, the interface blocks may be consideredarranged vertically or horizontally depending upon a position of themodule.

In FIGS. 11-13, interface blocks are provided such that the modules maycouple to the backplane without any plugs or other types of physicalinterfaces or connectors. The capacitive data pads enable a flat formfactor for the modules, and the power pins may include pushpins forsolid contact to transfer power.

FIGS. 14A-14B illustrate example placement of modules into backplanes ofmultiple configurations. In FIG. 14A, a small configuration backplane1400 is shown. A 1×1 module 1402 may be inserted into any of the 1×1slots. The example illustration shown is a view looking through themodule to see a placement of pins on an underside surface. The 1×1module 1402 may be universal and interface blocks may be positioned on abackside of a surface of the module 1402 such that the interface blocksmay couple to the interface blocks of the backplane 1400 and power pinsline up appropriately. Another 1×1 module 1404 is shown as well beinginserted into another 1×1 slot. In addition, 1×2 modules 1406 and 1408are shown being inserted into 1×2 slots.

In FIG. 14B, a medium configuration backplane 1450 is shown. As above, a1×1 module 1452 is shown being inserted into a 1×1 slot, and a 1×2module 1454 is shown being inserted into a 1×2 slot. The mediumconfiguration backplane 1450 may also include 1×2 slots in a horizontalconfiguration, and the 1×2 module may be rotated to fit into the slot sothat the power pins line up appropriately. Another 1×2 module 1456 isshown as being inserted into a horizontal 1×2 slot. Thus, 1×2 modulescan fit vertically or horizontally into vertical or horizontal slots byrotating the module so that the power pins line up appropriately.

The modules may be configured to be inserted into a slot in a specificorientation. Due to placement of the pads, the modules may be used inmultiple configurations of the device by rotating the modules intoappropriate slots. For example, on the small size device, a 1×1 modulemay be rotated 180 degrees to be used on the other side of the spine,and on a medium size device, a 1×2 module may be rotated 90 degrees tobe used on either side. The interface blocks may not be centered on themodules, but rather may be biased to a side.

In some examples, the modules may be configured to transfer data throughthe backplane using a D-PHY/M-PHY physical layer specification. D-PHYmay be configured to use four capacitive data pads per lane(bi-directional) while M-PHY may be configured to use two capacitivedata pads per lane (bi-directional). In other examples, the modules maybe configured to transfers data based on the UniPro specifications, USBor PCIe. The backplane may further include a microcontroller or FPGA(not shown) that communicates with the backplane via the capacitive padson the bottom of the modules or via another method. Data transferthrough the backplane may have any set or subset of the followingfeatures: high speed (gigabits/second), low power consumption (e.g.,through low swing signaling and standby modes), low pin count, highreliability, and high robustness.

In other examples, the modules and backplane may include optical datacontacts, and each may be configured to transfer data using an opticaldata transfer. Still other data transfer methods are possible as well,such as a high-frequency RF (e.g., 60 GHz) in which instance thebackplane and modules may be configured to include receivers andtransmitters, or near-field inductive communication could be used aswell to enable wireless transmission of data between coils within thebackplane and modules.

FIG. 15 illustrates a side view of an example device in which moduleshave been inserted. As shown in FIG. 15, once inserted, the modules maybe configured to provide a smooth and flat form factor for the device.In some examples, the backplane may have a horizontal and a verticaldimension, and slots are arranged to receive the modules such that themodules are constrained to be within the horizontal and verticaldimension. In other examples, modules may be allowed to violate thedimensional constraints of the backplane.

FIG. 16 illustrates a portion of an example device in which a moduleexceeds a thickness dimension of the device. For example, a number ofmodules are shown inserted into the backplane, and a module 1600 isshown as exceeding a thickness dimension, or “Z” direction dimension ofthe device. The module 1600 may include a camera with a z-axisexpansion, for example.

FIGS. 17A-17B illustrate an example device in which a module exceeds alength dimension of the device. FIG. 17A illustrates a number of modulesinserted into the backplane, and a module 1700 is shown exceeding alength of the device. The module 1700 may be a pulse oximeter modulewith a y-axis expansion. FIG. 17B illustrates example use of the module1700.

Modules may be placed into any slot in which the module fits. In someexamples, it may be desirable for some modules to be placed at certainpositions of the device. For example, for modules that emit a certainamount of radiation (e.g., radio waves), such modules may be positionedat a bottom of the device. In addition, in other examples, for modulesthat include antennas, such modules may be positioned to be toward aperimeter of the device to lower an amount of possible interference withother modules or components of the device.

Any number or type of modules may be used and inserted into devicesdescribed herein. In addition, some modules may be duplicates, or inother words, multiples of existing modules may be provided within agiven device, such as multiple batteries, for example. In yet otherexamples, a slot of the device may be filled with a blank module, whichmay be a cosmetic module or a module that does not include anyelectronics that are configured to perform any functionality so as tofill all slots of the device. A few examples are described below.

In one example, a display module may be inserted into a slot on thefront side or back side of the backplane. The display module may includean active matrix organic light emitting diode (AMOLED) display with anintegrated controller. The display module may be driven a GPU in adisplay module microcontroller using the MIPI DSI-1 interface over MIPID-Phy. The display module may include capacitive volume up-down buttonson a left-top side of the display module, and a power button on theright-top side of the display module. The display module may furtherinclude a microphone, for example.

Another example module includes a media module. The media module mayinclude a microphone and a speaker, and also a 3.5 mm headphone jack,for example.

Another example module may include a battery module that is configuredto provide a nominal open-circuit voltage of about 3.2V±0.2V. Thebattery module may have a nominal charging voltage of 3.6V±0.2V. Thebattery module may include a lithium polymer battery, and may alsoinclude a switching converter to power a 3.3 V bus, for example.

Another example module may include an application processor. Theapplication processor may be configured to operate according to anoperating system (OS), and may have a M-PCIe/UniPro interface. Theapplication processor module may further include a micro SD card slot,for example.

Another example module may include a communication module that includesan antenna configured to be compliant with a service provider andregulatory requirements (e.g., cellular communications). Thecommunication module may further include a Wifi module (or the Wifimodule may be a separate module) that includes functionality forwireless communications according to IEEE 802.11b, for example.

Another example module includes a USB connector module, which mayinclude a micro-B USB connector. Still other example modules may includea thermal imaging camera or a pulse oximeter module.

Modules may serve any function or purpose. Some example module typesinclude sensor modules, processor modules, storage modules,communication modules, display modules, and power modules. Examples ofsensor modules include accelerometer modules, GPS modules, cameramodules, depth imaging modules, fingerprint reader modules, biometricmodules, microphone modules, digital/analog input modules, haptic inputmodules, infrared flash modules, pedometer modules, barometer modules,magnetometer modules, and gyroscope modules. Examples of processormodules include application processor modules and graphics processormodules. Examples of storage modules include flash memory modules andRAM modules. Examples of communication modules include Wi-Fi radiomodules, GSM/CDMA radio modules, HDMI connector modules, NFC modules,Bluetooth radio modules, and USB connector modules. Examples of displaymodules include touchscreen LCD modules, non-touch graphical displaymodules, and e-ink display modules. Examples of power modules includebattery modules, solar panel modules, and battery charging modules. Thevariety of modules preferably serve to provide various options andcombinations of inputs, outputs, data storage, data processing,communication, power, and other suitable aspects of a computing device.Note that these example module types are in no way exhaustive orexclusive; i.e., modules may incorporate functionality from many ofthese example types or from none at all, and modules may additionally oralternatively incorporate suitable functionality not herein described.

FIG. 18 illustrates an expanded view of an example device. The device isshown with a backplane that comprises a front backplane 1802 and a backbackplane 1804. The front backplane 1802 may include horizontal rails,as described previously in FIGS. 3A-3C, and the back backplane 1804 mayinclude a spine and a number of horizontal ribs, as described previouslyin FIGS. 2A-2C. A display module 1806 may couple to the front backplane1802.

The front backplane 1802 may couple to the back backplane 1804 through abattery layer 1808 and a printed circuit board 1810. The battery layer1808 may provide power for the structure as well as act as a heat sinkto dissipate heat generated by displays and electronics on the printedcircuit board 1810. The battery layer 1808 provides power to allow forremoval and insertion of modules without powering down the device. Theprinted circuit board 1810 may include interface blocks, such asinterface blocks 1818 and 1814, and metal inserts between adjacentinterface blocks, such as metal insert 1816. The back backplane 1804 mayinclude openings within slots such that the printed circuit board 1810couples to the back backplane 1804 and content pad for the slots areinserted into the openings of the back backplane 1804 within the slots.

In some examples, the front backplane 1802 and the back backplane 1804,as well as the battery layer 1808 and the printed circuit board 1810,may be considered a backplane for the device that includes a front sideand a back side. Within examples, the backplane may thus refer to askeleton or base structure of the device, and not necessarily the backor rear-facing portion of the device since the device also supportsfront-facing modularity as well.

Within examples, the back backplane 1804 comprises a metal (e.g.,aluminum), and the metal housing enables heat to transfer from themodules to the housing to dissipate out of the modules and into the backbackplane 1804, so that the back backplane 1804 acts as a heat sink.

Likewise, the front backplane 1802 may also comprise a metal housing(e.g., aluminum) and the metal housing enables heat to transfer from themodules to the housing to dissipate out of the modules and into thefront backplane 1802, so that the front backplane 1802 acts as a heatsink.

Backplane housings may provide structural support in addition to oralternatively to providing heat transfer abilities. Backplane housingsmay be made of rigid materials to enable structural stability, but mayadditionally or alternatively be made of any suitable material.Backplane housings may also assist in managing radio-frequency (RF)characteristics; for example, the back backplane 1804 may be designed toelectromagnetically shield modules from one another. Backplane housingsmay also be designed to serve as antennas at one or multiple frequenciesfor modules (or for any electronics included within the printed circuitboard 1810.

FIG. 24 illustrates an example view of a printed circuit board. Theprinted circuit board 2410 includes an FPGA, microprocessor, and/ormicrocontroller 2420 (referred to simply as the FPGA 2420, though it isrecognized that the pictured circuitry may be an FPGA, microprocessor,and/or a microcontroller) and a plurality of interface blocks 2430. TheFPGA may include a network communication switch (which enablescommunication between modules connected to the interface blocks 2430).

FIG. 25 illustrates an example schematic view of a printed circuitboard. The printed circuit board 2510 includes network communicationswitch 2520 and a plurality of interfaces blocks 2530.

The network communication switch 2520 functions to enable directcommunication between modules by creating data links between modules(which the switch 2520 may modify, monitor, or control). By monitoringand/or controlling data links between modules, the switch 2520 canmediate module data transfer. The switch 2520 may operate using packetswitching or in any other suitable manner (e.g., circuit switching). Theswitch 2520 may control communication by setting bandwidth limits, laneassignments, data rate limits, or any other suitable data transferconfiguration data. Other examples of data transfer configuration datainclude module priority levels; module priority levels determine howmodules are assigned bandwidth over time. For example, if two modulessend data transfer requests at the same time and the switch 2520 capableof processing them only serially (as opposed to in parallel), the switch2520 may allow the module with the higher module priority level totransfer data first. As another example, if two modules request 400MBpbs of communication bandwidth, but the switch 2520 has only 600 MBpsbandwidth available, the switch 2520 may grant the module with higherpriority level the full 400 MBps requested, while granting the modulewith lower priority level only 200 MBps of communication bandwidth.

Direct communication preferably refers to data transfer that does notrequire a host or intermediary module for communication. For example,modules can communicate directly by sending packets to the switch 2520,which then are sent directly to other modules based on the destinationaddress (set by the originating module). This is distinct from anarchitecture that requires a host; for example, peripheral devicesconnected to a USB bus require a master device to be able to passinformation between each other. Another consequence of this is themaximum bandwidth available for inter-device communication is inherentlylimited by the bandwidth of connections to the master device and theprocessing capability of the master device.

FIG. 19 illustrates an expanded view of an example module. The moduleincludes a back cover 1902, an electronics board 1904, a shielding layer1906, and a front cover 1908. The back cover 1902 may expose contacts orinterfaces of the electronics board 1904 for coupling purposes. Thefront cover 1908 may couple to the back cover 1902 and may be customizedto include any type of graphics or aesthetic design, and may be replacedas well. The shielding layer 1906 protects the electronics board 1904while the front cover 1908 is removed. The shielding layer 1906 furtherenables all modules to behave similarly for radio frequency (RF)emissions and helps for antenna design, for example. In some examples,the module may further include a thin pad of conductive foam (not shown)on a bottom of the module to fill space and enable a snug fit into aslot, as well as to reduce transmission of radiation.

The electronics board 1904 includes power pins and data transfer pins1910, as well as an electro-permanent magnet 1912, and may also includeother data transfer interfaces (e.g., capacitive data pads or opticaltransfer interfaces). The electro-permanent magnet 1912 may be activatedto hold the module into place within a device.

The electronics board 1904 may include any electronics used by themodule; for example, microcontrollers, microprocessors, sensors,actuators, batteries, or any other electronic components.

FIGS. 20 and 21 illustrate portions of a module including anelectro-permanent magnet. The electro-permanent magnet does not requireconstant power, but rather, a voltage pulse is provided toelectro-permanent magnet for activation and then the electro-permanentmagnet is permanently magnetic in that state. The electro-permanentmagnet can be provided another voltage pulse to de-magnetize theelectro-permanent magnet. Thus, the electro-permanent magnet is a typeof magnet that includes both an electromagnet and a permanent magnet andin which a magnetic field produced by the electro-magnet is used tochange a magnetization of the permanent magnet. The permanent magnetincludes magnetically hard and soft materials, of which only the softmaterial can have its magnetization changed. When the magnetically softand hard materials have opposite magnetizations the magnet has no netfield, and when the magnetically soft and hard materials are aligned themagnet displays magnetic behavior.

In FIG. 20, an electro-permanent magnet includes a copper wire coil 2002and magnetic material 2004. An H-Bridge comprised from six discreteMOSFET transistors drives the magnets, which are wired in series. Fourof the transistors are wired as an H-bridge, and the other two providethe gate drive. Four microcontroller GPIO pins are used to control theH-bridge. The magnets can be driven with 26 Volts DC (as a 50microsecond, 10 ampere pulse) which may be stored in a tantalumcapacitor.

In FIG. 21, an example module is shown to include two electro-permanentmagnets 2101 and 2104. For example, rear-mounted modules (e.g., 1×2 or2×2 modules) may include two electro-permanent magnets that may beactivated to mechanically attach/release the module to steel inserts onthe backplane under software control. A short positive-voltage pulseturns on magnetic holding, and a short negative-voltage pulse turns offholding. No quiescent power is needed in either the holding or releasedstate.

FIG. 22 illustrates a portion of a device in which a module is securedto the device via an electro-permanent magnet. A module 2202 includes anelectro-permanent magnet 2204 and may be inserted into a slot formed byrails 2206 and 2208 and a spine 2210. The module 2202 may slide into theslot such that the module 2202 fits within grooves of the rails due to acurved radius of a perimeter or sides of the module and an oppositecurvature being present in the rails 2206 and 2208.

A metal insert 2212 is included in the spine 2210 within a slot, and isconfigured to line up with the electro-permanent magnet 2204 of themodule 2202 when the module 2202 is inserted into the slot. The devicemay include a built-in battery (not shown), that is separate from abattery module, which provides power for switching the electro-permanentmagnet 2204 of the module 2202 (and possibly also provides reserve powerfor the device). The device may include a built-in battery to enable anybattery module of the device to be removed, and also enable othermodules to be removed and inserted by activation of electro-permanentmagnets.

Within examples, the metal insert 2212 is configured to secure themodule 2202 within the slot via a received magnetic force from theelectro-permanent magnet 2204.

FIG. 23 illustrates portions of a device in which a module is secured tothe device. A front side of the device is shown. On a front side, abackplane does not include a spine extending along a length of thedevice, and thus, metal inserts may not be present for the modules tolock onto via an electro-permanent magnet. The front side does includerails, for example, such as rails 2302 and 2304. The rails 2302 and 2304include grooves into which a front side module, such as display module2306 or media module 2308, may slide into to secure to the backplane.

In addition, modules may include other mechanisms to lock into thedevice. For example, the module 2308 may include a ball spring 2310 thatis configured to compress into the module 2308 during insertion of themodule 2308 to the front side of the backplane and to extend into acorresponding opening within the rail 2302 of the backplane based onforce from the spring to secure the module 2308 into position on thefront side of the backplane. The module 2308 may further includeelectro-permanent magnets 2312 and 2314 coupled to the ball spring 2310,and when the module 2308 is inserted into the device, theelectro-permanent magnets 2312 and 2314 may be activated to cause theball spring to remain extended into the corresponding opening within thefront side of the backplane. For example, the electro-permanent magnets2312 and 2314 may force a base 2316 that is coupled to a pin 2318internal to the ball spring 2310 to push the pin 2318 upward forcing theball spring 2310 against the rail 2302. Thus, the ball spring 2310 isforced into the corresponding opening or divot in the rail 2302 whichprevents the module 2308 from being removed from the device.

In some examples, the module 2308 may be configured to enable datatransfer to the device via the pin 2318 of the ball spring 2310 inaddition to or alternatively from the data pad on an underside surfaceof the module 2308.

Within examples, the device may be configured to provide rear-facingmodularity, front-facing modularity, or both to enable modules to bepositioned on a front and/or back of the device. As described, modulespositioned on a backside of the device may be configured to lock inplace using electro-permanent magnets, and modules on a front side ofthe device may be configured to lock in place using a ball spring. Inother examples, modules on the backside of the device may also oralternatively be configured to lock in place using a ball spring, andmodules on the front side of the device may also or alternatively beconfigured to lock in place using the electro-permanent magnetconfiguration. Thus, modules may include one or both of the magnetic andmechanical mechanism to lock in place. Also, modules may beinterchangeable and may be positioned on a front side or a backside ofthe device depending on a slot configuration of the device, for example.

In one example, a module may include an accelerometer or other inertialmeasurement unit (IMU), and may be configured to communicate with allother modules of the device. The accelerometer module may be configuredto detect changes in acceleration due to the device falling, forexample. Based on a detected change in acceleration that exceeds athreshold, the accelerometer module may be configured to cause thebackplane to eject all modules. In some examples, modules may be ejectedby de-magnetizing the electro-permanent magnets. In other examples, themodules may be ejected by causing the electro-permanent magnets to bemagnetized in an opposite polarity that pushes the modules out.

It should be understood that arrangements described herein are forpurposes of example only. As such, those skilled in the art willappreciate that other arrangements and other elements (e.g. machines,interfaces, functions, orders, and groupings of functions, etc.) can beused instead, and some elements may be omitted altogether according tothe desired results. Further, many of the elements that are describedare functional entities that may be implemented as discrete ordistributed components or in conjunction with other components, in anysuitable combination and location, or other structural elementsdescribed as independent structures may be combined.

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purposes ofillustration and are not intended to be limiting, with the true scopebeing indicated by the following claims, along with the full scope ofequivalents to which such claims are entitled. It is also to beunderstood that the terminology used herein is for the purpose ofdescribing particular embodiments only, and is not intended to belimiting.

We claim:
 1. A modular smartphone comprising: a backplane comprising ametal housing, a battery layer and a printed circuit board; wherein themetal housing includes a set of slots configured to receiveuser-removable modules; wherein the metal housing includes a set ofrails configured to form the set of slots; a set of interface blocks,electrically coupled to the printed circuit board, positioned within oneor more of the set of slots, that enable power transfer and datatransfer between modules coupled to the set of interface blocks; whereinpower transfer and data transfer between modules occur via the printedcircuit board; and a network communication switch, located on andelectrically coupled to the printed circuit board, that mediates datatransfer between modules coupled to the set of interface blocks.
 2. Thesmartphone of claim 1, wherein the set of rails comprises a spineextending along the length of the metal housing and a set of ribspositioned perpendicular to the spine and extending from the spine to aperimeter of the backplane.
 3. The smartphone of claim 2, furthercomprising a front backplane configured to receive a display module. 4.The smartphone of claim 3, wherein the set of slots and the set of railsare arranged according to a rectangular grid and the set of slots isconfigured to receive modules corresponding to integer multiples of aunit cell size of the rectangular grid.
 5. An electronic devicecomprising: a backplane including a set of slots configured to receiveuser-removable modules; a set of rails defining the set of slots,wherein the set of rails comprises a spine extending along the length ofa metal housing and a set of ribs positioned perpendicular to the spineand extending from the spine to a perimeter of the backplane, whereinthe spine comprises a set of metal inserts, each metal insert of the setof metal inserts positioned within a slot of the set of slots, whereinthe set of metal inserts is configured to retain modules inserted in theset of slots via magnetic force; a printed circuit board, coupled to thebackplane; and a set of interface blocks, electrically connected to theprinted circuit board, that enable power and data transfer betweenmodules coupled to the set of interface blocks.
 6. The device of claim5, wherein an interface block of the set of interface blocks includes apower contact, configured to enable power transfer between a modulecoupled to the interface block and the printed circuit board, and a datainterface, configured to enable data transfer between the module and theprinted circuit board.
 7. The device of claim 6, wherein the powercontact comprises power pins and the data interface comprises capacitivepads.
 8. The device of claim 5, wherein the printed circuit boardcomprises a network switch that enables direct communication betweenmodules coupled to the set of interface blocks.
 9. The device of claim8, wherein the network switch is a packet switch.
 10. The device ofclaim 8, wherein data transfer between a first module coupled to thenetwork switch and a second module coupled to the network switch isinitiated by the first module and completed without using a host or anintermediate module.
 11. The device of claim 5, wherein the spinecomprises a set of electropermanent magnet.
 12. The device of claim 5,further comprising first and second modules electrically coupled to theprinted circuit board; wherein the first module comprises a battery andprovides power to the second module via the printed circuit board. 13.An electronic device comprising: a backplane including a set of slotsconfigured to receive user-removable modules; a set of rails definingthe set of slots, wherein the set of rails comprises a spine extendingalong the length of a housing and a set of ribs positioned perpendicularto the spine and extending from the spine to a perimeter of thebackplane, wherein the spine comprises a set of electropermanentmagnets, each electropermanent magnet of the set of electropermanentmagnets positioned within a slot of the set of slots; wherein the set ofelectropermanent magnets is configured to retain modules inserted in theset of slots via magnetic force; a printed circuit board, coupled to thebackplane; and a set of interface blocks, electrically connected to theprinted circuit board, that enable power and data transfer betweenmodules coupled to the set of interface blocks.
 14. The device of claim13, wherein an interface block of the set of interface blocks includes apower contact, configured to enable power transfer between a modulecoupled to the interface block and the printed circuit board, and a datainterface, configured to enable data transfer between the module and theprinted circuit board.
 15. The device of claim 14, wherein the powercontact comprises power pins and the data interface comprises capacitivepads.
 16. The device of claim 13, wherein the printed circuit boardcomprises a network switch that enables direct communication betweenmodules coupled to the set of interface blocks.
 17. The device of claim16, wherein the network switch is a packet switch.
 18. The device ofclaim 16, wherein data transfer between a first module coupled to thenetwork switch and a second module coupled to the network switch isinitiated by the first module and completed without using a host or anintermediate module.
 19. The device of claim 13, wherein the spinecomprises a set of metal inserts.
 20. The device of claim 13, thithercomprising first and second modules electrically coupled to the printedcircuit board, wherein the first module comprises a battery and providespower to the second module via the printed circuit board.